Sa***c : CLP-107-02-F-D-BE-K - Low Profile Dual-Wipe Socket ...
The CLP series is rugged and reliable printed circuit board mount socket. Suitable for top- and bottom-entry applications, the CLP utilizes the Samtec Tiger ...
Sa***c : CLP-107-02-F-D-BE-A-K-TR - Low Profile Dual-Wipe ...
The CLP series is rugged and reliable printed circuit board mount socket. Suitable for top- and bottom-entry applications, the CLP utilizes the Samtec Tiger ...
Di***ey : CLP-107-02-F-D-BE Samtec Inc. | Connectors, Interconnects
CLP-107-02-F-D-BE – 14 Position Receptacle, Bottom Entry Connector 0.050" (1.27mm) Surface Mount Gold from Samtec Inc.. Pricing and Availability on millions ...
Di***ey : CLP-107-02-F-D-BE-K-TR Samtec Inc.
CLP-107-02-F-D-BE-K-TR ; Features. Pick and Place ; Current Rating (Amps). 3.3A per Contact ; Voltage Rating. 240VAC, 330VDC ; Applications. - ; Insulation Material.
Mo***r Electronics : CLP-107-02-F-D-BE-A Samtec
CLP-107-02-F-D-BE-A Samtec Headers & Wire Housings Low Profile Dual-Wipe Socket, .050 Pitch datasheet, inventory, & pricing.
Mo***r Electronics : CLP-107-02-F-D Samtec
These rugged sockets are insulated with black liquid crystal polymer and withstand 100 mating cycles. Samtec Tiger Claw socket strips have a -55°C to +125°C ...
Fa***ll : samtec clp-107-02-fd-be-a - PCB Receptacles
Buy CLP-107-02-F-D-BE-A - Samtec - PCB Receptacle, Board-to-Board, 1.27 mm, 2 Rows, 14 Contacts, Surface Mount, CLP. Farnell België offers fast quotes, ...
Am***n : CLP-107-02-F-D.050" Tiger Claw Rugged Reliable Dual ...
CLP-107-02-F-D.050" Tiger Claw Rugged Reliable Dual Wipe Socket Strip (25 Items): Amazon Industrial & Scientific.
Oc***art : CLP-107-02-F-D-BE Samtec - Headers and Wire Housings
Physical. Contact Material, Bronze. Contact Plating, Gold. Mount, Surface Mount. Technical. Gender, Receptacle. Number of Contacts, 14. Number of Rows, 2.
He***ner : CLP-107-02-F-D-BE-PA-TR Datasheet
Part Number # CLP-107-02-F-D-BE-PA-TR (Rectangular Connectors - Headers, Receptacles, Female Sockets) is manufactured by Samtec Inc. and distributed by ...