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Tanssion > Produits > Connecteurs, interconnexions > Baquets pour CI, transistors

Baquets pour CI, transistors

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Image Numéro de pièce Fabricant Fiche technique Prix (USD) Applications Catégorie de produits Remarque Qté RFQ

Type

Série

Package

Features

Partie Statut

Termination

Pitch - Post

Type de montage

Pitch - Mating

Matériel de logement

Contact Finish - Post

Température opérationnelle

Contact Finish - Mating

Matériel de contact - Post

Matériel de contact - Mating

Contact Finish Épaisseur - Post

Contact Finish Épaisseur - Mating

Nombre de positions ou de pins ( Réseau )

DILB42P-223TLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0.29

10+: $0.2871

100+: $0.2842

500+: $0.2813

1000+: $0.2784

Home theater & entertainment
Tablets
Appliances

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

3797 In Stock
RFQ
DIP, 0.6"" (15.24mm) Row Spacing DILB Tube Open Frame Active Solder 0.100"" (2.54mm) Through Hole 0.100"" (2.54mm) Polyamide (PA), Nylon Tin-Lead -55°C ~ 125°C Tin-Lead Copper Alloy Copper Alloy 100.0µin (2.54µm) 100.0µin (2.54µm) 42 (2 x 21)

D8864-42

(Alternative models available)

Harwin

1+: $6.36

10+: $6.2964

100+: $6.2328

500+: $6.1692

1000+: $6.1056

Power delivery
Tablets
PC & notebooks

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Harwin.
Tanssion is one of the Distributors.
Wide range of applications.

3715 In Stock
RFQ
DIP, 0.75"" (19.05mm) Row Spacing D8864 Tube Open Frame Active Solder 0.070"" (1.78mm) Through Hole 0.070"" (1.78mm) Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Tin -55°C ~ 125°C Gold Brass Beryllium Copper 196.9µin (5.00µm) Flash 64 (2 x 32)

DILB18P223TLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Infotainment & cluster
Medical
Mobile phones

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

521 In Stock
RFQ
- * - - - - - - - - - - - - - - -

DIP640-011BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Hybrid, electric & powertrain systems
Power delivery
Connected peripherals & printers

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

654 In Stock
RFQ
DIP, 0.6" (15.24mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 10.0µin (0.25µm) 40 (2 x 20)

DIP624-011BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Body electronics & lighting
Test & measurement
Wearables (non-medical)

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

977 In Stock
RFQ
DIP, 0.6" (15.24mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 10.0µin (0.25µm) 24 (2 x 12)

DIP632-001BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Wireless infrastructure
Data center & enterprise computing
Data storage

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

183 In Stock
RFQ
DIP, 0.6" (15.24mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 30.0µin (0.76µm) 32 (2 x 16)

DIP628-001BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Appliances
Factory automation & control
TV

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

869 In Stock
RFQ
DIP, 0.6" (15.24mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 30.0µin (0.76µm) 28 (2 x 14)

DIP640-001BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Broadband fixed line access
Medical
Tablets

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

126 In Stock
RFQ
DIP, 0.6" (15.24mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 30.0µin (0.76µm) 40 (2 x 20)

DIP328-014BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Infotainment & cluster
Medical
PC & notebooks

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

535 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Tin Brass Beryllium Copper 200.0µin (5.08µm) 100.0µin (2.54µm) 28 (2 x 14)

DIP324-014BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Advanced driver assistance systems (ADAS)
Pro audio, video & signage
Mobile phones

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

295 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Tin Brass Beryllium Copper 200.0µin (5.08µm) 100.0µin (2.54µm) 24 (2 x 12)

DIP328-011BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Building automation
Electronic point of sale (EPOS)
Enterprise machine

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

498 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 10.0µin (0.25µm) 28 (2 x 14)

DIP318-011BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Datacom module
Motor drives
Gaming

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

430 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 10.0µin (0.25µm) 18 (2 x 9)

DIP316-011BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Infotainment & cluster
Data center & enterprise computing
TV

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

953 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 10.0µin (0.25µm) 16 (2 x 8)

DIP324-011BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Wireless infrastructure
Building automation
Enterprise machine

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

534 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 10.0µin (0.25µm) 24 (2 x 12)

DIP314-001BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Wired networking
Building automation
Enterprise machine

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

553 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 30.0µin (0.76µm) 14 (2 x 7)

DIP324-001BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Hybrid, electric & powertrain systems
Medical
Enterprise projectors

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

504 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 30.0µin (0.76µm) 24 (2 x 12)

DIP316-001BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Building automation
Factory automation & control
PC & notebooks

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

794 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 30.0µin (0.76µm) 16 (2 x 8)

DIP316-014BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Hybrid, electric & powertrain systems
Power delivery
Connected peripherals & printers

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

473 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Tin Brass Beryllium Copper 200.0µin (5.08µm) 100.0µin (2.54µm) 16 (2 x 8)

DIP628-014BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Datacom module
Data center & enterprise computing
Portable electronics

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

534 In Stock
RFQ
DIP, 0.6" (15.24mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Tin Brass Beryllium Copper 200.0µin (5.08µm) 100.0µin (2.54µm) 28 (2 x 14)

DIP306-001BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Wireless infrastructure
Medical
Connected peripherals & printers

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

737 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 30.0µin (0.76µm) 6 (2 x 3)

DIP050-628-160BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Wired networking
Lighting
PC & notebooks

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

361 In Stock
RFQ
DIP, 0.6" (15.24mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Gold Brass Beryllium Copper 200.0µin (5.08µm) 30.0µin (0.76µm) 28 (2 x 14)

DIP050-628-157BLF

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Advanced driver assistance systems (ADAS)
Factory automation & control
Home theater & entertainment

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

89 In Stock
RFQ
DIP, 0.6" (15.24mm) Row Spacing - Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin - Tin Brass Beryllium Copper 200.0µin (5.08µm) 100.0µin (2.54µm) 28 (2 x 14)

DPF316-998Z

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Advanced driver assistance systems (ADAS)
Pro audio, video & signage
PC & notebooks

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

355 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing DPF3 Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin-Lead - Tin-Lead Brass Beryllium Copper 200.0µin (5.08µm) 200.0µin (5.08µm) 16 (2 x 8)

DPF314-998Z

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Appliances
Data center & enterprise computing
Mobile phones

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

529 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing DPF3 Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin-Lead - Tin-Lead Brass Beryllium Copper 200.0µin (5.08µm) 200.0µin (5.08µm) 14 (2 x 7)

DPF308-998Z

(Alternative models available)

Storage & Server IO (Amphenol ICC)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

Aerospace & defense
Test & measurement
Data storage

Products:Connecteurs, interconnexions--Baquets pour CI, transistors

Manufacturers: Storage & Server IO (Amphenol ICC).
Tanssion is one of the Distributors.
Wide range of applications.

353 In Stock
RFQ
DIP, 0.3" (7.62mm) Row Spacing DPF3 Bag Open Frame - Solder 0.100" (2.54mm) Through Hole 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tin-Lead - Tin-Lead Brass Beryllium Copper 200.0µin (5.08µm) 200.0µin (5.08µm) 8 (2 x 4)